Chinese giant Huawei seems to be working on their next flagship device in Mate series, the successor of Mate 8 which has been launched last year – Huawei Mate 9. According to the industry analyst Pan Jiutang, Huawei Mate 9 will be released by the end of this year. He says that the device will be powered with Huawei’s next gen In-house Chipset Kirin 960 SoC. The Huawei’s Kirin 960 Chipset will be mass produced by using 16nm process, powered with ARM Artemis cores and will have an Octa-Core GPU paired.
Huawei’s recently launched smartphone P9 was powered with Kirin 955 SoC, including 12MP dual-camera setup, with one of them of co-engineered with Leica. According to Pan Jiutang, the upcoming Huawei Mate 9 will also feature a dual-camera setup, but with a powerful 20MP sensors, having fastest AutoFocus and other depth field features.
Other rest of informations about remaining specs are still unknown, and we could assume its RAM as around 4GB to 6GB and the storage might have 32GB or 64GB. There is more details are waiting to leak about the device. The Mate 9 would be the device for U.S, which Huawei has declared earlier.