Samsung has just made an important announcement. The South Koren tech giant has announced a new type of chipset for their upcoming smartphones. The new chipsets are of 11-nanometer (nm) FinFET process technology (11LPP, Low Power Plus). They are aimed to deliver high performance for the Samsung’s high-end devices.
Ryan Lee, Vice President and Head of Foundry Marketing at Samsung Electronics, said: “Samsung has added the 11nm process to our roadmap to offer advanced options for various applications, “Through this, Samsung has completed a comprehensive process roadmap spanning from 14nm to 11nm, 10nm, 8nm, and 7nm in the next three years.”
Not only the high-end models, some of the upcoming mid-range models will also feature this chipset. Through further scaling from the earlier 14LPP process, 11LPP delivers up to 15 percent higher performance and up to 10 percent chip area reduction with the same power consumption.
It promises up to 15% boost in performance with the same power use. The chip area will be reduced by 10%, meaning the manufacturing price of chips will fall. Expect the first 11nm chipsets to come out in the first half of 2018.
Samsung also confirmed that development of 7LPP with EUV (extreme ultra violet) lithography technology is on schedule, targeting its initial production in the second half of 2018. So the new 7nm and 11nm chipsets are coming soon.